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Details, datasheet, quote on part number:TPS2828DBVR
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| Part: | TPS2828DBVR |
| Category: | Power Management => Power Distribution/Switches => MOSFET Drivers => MOSFET and Power Drivers |
| Description: | ti TPS2828, Inverting High-speed MOSFET Driver |
| Company: | Texas Instruments, Inc. |
| Datasheet: | Download TPS2828DBVR datasheet File size : 358 kB |
| Request For quote: | Find where to buy TPS2828DBVR
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Datasheet text preview:
TPS2816, TPS2817, TPS2818, TPS2819, TPS2828, TPS2829, SINGLE CHANNEL HIGH SPEED MOSFET DRIVER
SLVS160C FEBRUARY 1997 REVISED OCTOBER 2002
D Low-Cost Single-Channel High-Speed D D D D D D D
MOSFET Driver ICC . . . 15-µA Max (TPS2828, TPS2829) 25-ns Max Rise/Fall Times and 40-ns Max Propagation Delay . . . 1-nF Load 2-A Peak Output Current 4-V to 14-V Driver Supply Voltage Range; Internal Regulator Extends Range to 40 V (TPS2816, TPS2817, TPS2818, TPS2819) 5-pin SOT-23 Package 40°C to 125°C Ambient-Temperature Operating Range Highly Resistant to Latch-ups
TPS2816, TPS2817 TPS2818, TPS2819 DBV PACKAGE (TOP VIEW) VDD GND IN 1 2 5 VCC
3
4
OUT
TPS2828, TPS2829 DBV PACKAGE (TOP VIEW) NC GND IN 1 2 5 VCC
description
The TPS28xx single-channel high-speed MOSFET drivers are capable of delivering peak currents of up to 2 A into highly capacitive loads. High switching speeds (tr and tf = 14 ns typ) are obtained with the use of BiCMOS outputs. Typical threshold switching voltages are 2/3 and 1/3 of VCC. The design inherently minimizes shootthrough current.
3
4
OUT
NC No internal connection
A regulator is provided on TPS2816 through TPS2819 devices to allow operation with supply inputs between 14 V and 40 V. The regulator output can be used to power other circuits, provided power dissipation does not exceed package limitations. If the regulator is not required, VDD (the regulator input) should be connected to VCC. The TPS2816 and TPS2817 input circuits include an active pullup circuit to eliminate the need for an external resistor when using open-collector PWM controllers. The TPS2818 and TPS2819 are identical to the TPS2816 and TPS2817, except that the active pullup circuit is omitted. The TPS2828 and TPS2829 are identical to the TPS2818 and TPS2819, except that the internal voltage regulator is omitted, allowing quiescent current to drop to less than 15 µA when the inputs are high or low. The TPS28xx series devices are available in 5-pin SOT-23 (DBV) packages and operate over an ambient temperature range of 40_C to 125_C.
AVAILABLE OPTIONS PACKAGED DEVICES TA FUNCTION Inverting driver with active pullup input Noninverting driver with active pullup input 40°C to 125°C to 125°C Inverting driver Noninverting driver Inverting driver, no regulator Noninverting driver, no regulator The DBV package is available taped and reeled only. SOT-235 (DBV) TPS2816DBV TPS2817DBV TPS2818DBV TPS2819DBV TPS2828DBV TPS2829DBV CHIP FORM (Y) TPS2816Y TPS2817Y TPS2818Y TPS2819Y TPS2828Y TPS2829Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2002, Texas Instruments Incorporated
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TPS2816, TPS2817, TPS2818, TPS2819, TPS2828, TPS2829, SINGLE CHANNEL HIGH SPEED MOSFET DRIVER
SLVS160C FEBRUARY 1997 REVISED OCTOBER 2002
functional block diagram
TPS2816, TPS2818 TPS2817, TPS2819
VDD Active Pullup (TPS2816 Only) IN GND
VREG
VCC
VDD Active Pullup (TPS2817 Only)
VREG
VCC
OUT
IN GND
OUT
TPS2828 VCC
TPS2829 VCC
IN GND
OUT
IN GND
OUT
INPUT STAGE DIAGRAM VCC
OUTPUT STAGE DIAGRAM VCC Predrive
IN
To Drive Stage OUT
2
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TPS2816, TPS2817, TPS2818, TPS2819, TPS2828, TPS2829, SINGLE CHANNEL HIGH SPEED MOSFET DRIVER
SLVS160C FEBRUARY 1997 REVISED OCTOBER 2002
TPS28xxY chip information
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(4)
(5)
(4) OUT (2) GND (3) IN TPS2816Y (1) VDD (5) VCC
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(2)
TPS2816 through TPS2819 only CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150°C TOLERANCES ARE ±10%.
(3)
(1)
ALL DIMENSIONS ARE IN MILS.
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Terminal Functions
TPS2816, TPS2818, TPS2828 (inverting driver)
TERMINAL NAME VDD GND IN OUT VCC NO. 1 2 3 4 5 Ground Driver input. Driver output, OUT = IN Driver supply voltage/regulator output voltage DESCRIPTION Regulator supply voltage input. (Not connected on TPS2828)
TPS2817, TPS2819, TPS2829 (noninverting driver)
TERMINAL NAME VDD GND IN OUT VCC NO. 1 2 3 4 5 Ground Driver input. Driver output, OUT= IN Driver supply voltage/regulator output voltage DESCRIPTION Regulator supply voltage input. (Not connected on TPS2829)
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