Details, datasheet, quote on part number: LP2985-28IYEUT
PartLP2985-28IYEUT
Category
Description150-mA Low-Noise, Low-dropout Regulator With Shutdown
CompanyTexas Instruments, Inc.
DatasheetDownload LP2985-28IYEUT datasheet
  

 

Features, Applications

NanoStar and NanoFree Wafer Chip Scale Packages Output Tolerance of: 1% (A Grade) - 1.5% (Standard Grade) Ultra-Low Dropout, Typically mV at Full Load 1 mA Wide VIN Range. 16 V Max Low IQ. A at Full Load 150 mA Shutdown Current. 0.01 A Typ Low Noise. 30 VRMS With 10-nF Bypass Capacitor Stable With Low-ESR Capacitors, Including Ceramic Overcurrent and Thermal Protection High Peak-Current Capability Portable Applications: - Cellular Phones - Palmtop and Laptop Computers - Personal Digital Assistants (PDAs) - Digital Cameras and Camcorders - CD Players - MP3 Players

YEQ, YEU, YZQ, OR YZU (WCSP) PACKAGE (TOP VIEW) C1 B2

The LP2985 family of fixed-output, low-dropout regulators offers exceptional, cost-effective performance for both portable and nonportable applications. Available in voltages 3.3 V, and 5 V, the family has an output tolerance of 1% for the A version (1.5% for the non-A version) and is capable of delivering 150-mA continuous load current. Standard regulator features, such as overcurrent and overtemperature protection, are included. The LP2985 has a host of features that makes the regulator an ideal candidate for a variety of portable applications:

Low dropout: A PNP pass element allows a typical dropout at 150-mA load current and at 1-mA load. Low quiescent current: The use of a vertical PNP process allows for quiescent currents that are considerably lower than those associated with traditional lateral PNP regulators. Shutdown: A shutdown feature is available, allowing the regulator to consume only 0.01 A when the ON/OFF pin is pulled low. Low-ESR-capacitor friendly: The regulator is stable with low-ESR capacitors, allowing the use of small, inexpensive, ceramic capacitors in cost-sensitive applications. Low noise: A BYPASS pin allows for low-noise operation, with a typical output noise 30 V (RMS), with the use a 10-nF bypass capacitor.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Small packaging: For the most space-constraint needs, the regulator is available in SOT-23 package, as well as NanoStar wafer chip scale packaging, offering an even smaller size with improved thermal and electrical characteristics. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION

PACKAGE Reel of 3000 Reel of 250 Reel of 3000 Reel of 250 Reel of 3000 Reel of 250 Reel of 3000 Reel of 250 Reel of 3000 Reel 250 SOT23-5 (DBV) Reel of 3000 Reel of 250 Reel of 3000 Reel of 250 Reel of 3000 Reel of 250 Reel of 3000 Reel of 250 Reel of 3000 Reel of 250

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV: The actual top-side marking has one additional character that designates the assembly/test site.

TJ PART GRADE VOUT (NOM) 125C A grade: 1% tolerance 3.3 V NanoFree - WCSP 0.30-mm Bump (YZU, Pb-free) Reel of 3000 NanoFree - WCSP 0.30-mm Bump (YEU) Reel of 3000 NanoFree - WCSP 0.17-mm Bump (YZQ, Pb-free) Reel of 3000 NanoStar - WCSP 0.17-mm Bump (YEQ) Reel of 3000 PACKAGE ORDERABLE PART NUMBER LP2985A-32YZUR LP2985A-33YZUR TOP-SIDE MARKING

5V LP2985A-50YZUR Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. YEQ/YZQ, YEU/YZU: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).


 

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