|Category||Semiconductors => Power Management => LCD/OLED Display Bias Solutions|
|Part family||BUF11704 18-V Supply Multi-Channel Gamma Correction Buffer|
|Description||18-V Supply Multi-Channel Gamma Correction Buffer 28-HTSSOP -25 to 85|
|Company||Texas Instruments, Inc.|
|Datasheet||Download BUF11704AIPWP datasheet
|Pin nb||Package type||Ind std||JEDEC code||Package qty||Carrier||Device mark||Width (mm)||Length (mm)||Thick (mm)||Pitch (mm)|
|• Driving Capacitive Loads with Gamma Buffers | Doc|
FEATURES D Wide Supply Range: V D Gamma Correction Channels: 10, 6, and 4 D Integrated VCOM Buffer D Excellent Output Current Drive:
- Gamma Channels: 0.5 V Swing Rails(1) - VCOM: 100 mA typ 2 V Swing to Rails(1) Large Capacitive Load Drive Capability Rail-to-Rail Output PowerPAD Package Low-Power/Channel: 500 µA High ESD Rating: 8 kV HBM, 2 kV CDM, V MM Specified for to +85°CDESCRIPTION
The BUFxx704 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. They are pin-compatible with the existing BUFxx702 and BUFxx703 family and operate at higher supply voltages (19 V absolute max). The higher supply voltage enables faster response times and brighter images in large-screen LCD panels. This is especially important in LCD TV applications. The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, 10, 6, and 4 channel options are offered. For additional space and cost savings, a VCOM channel with > 100mA drive capability is integrated into the BUF11704, BUF07704, and BUF05704. The BUF07704, BUF06704, and BUF05704 are available in the TSSOP-20, TSSOP-14, and TSSOP-16 PowerPAD packages for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package. A flow-through pin out has been adopted to allow simple PCB routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx704 incorporate internal ESD protection circuits that prevent functional failures at voltages 8 kV (HBM), 2 kV (CDM), and 300 V (MM).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
over operating free-air temperature range unless otherwise noted(1) PARAMETERS Supply Voltage, VDD(2) Input Voltage Range, VI Continuous Total Power Dissipation Operating Free-Air Temperature Range, TA Maximum Junction Temperature, TJ Storage Temperature Range, TSTG Lead Temperature 1.6mm (1/16 inch) from Case for 10s ESD Rating: Human Body Model (HBM) Charged-Device Model (CDM) Machine Model (MM) BUFxx704 19 ±VDD See Dissipation Rating Table °C kV UNIT V
V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND.
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR(1) PWP SPECIFIED TEMPERATURE RANGE to +85°C PACKAGE MARKING BUF07704 BUF11704 ORDERING NUMBER BUF11704AIPWP BUF11704AIPWPR TRANSPORT MEDIA, QUANTITY Tube, 94 Reels, 2000 Tube, 94 Reels, 2000 Tube, 70 Reels, 2000 Tube, 50 Reels, 2000
(1) For the most current specification and package information, refer to our web site at www.ti.com. (2) Available Q3 2004
PACKAGE TYPE TSSOP-20 TSSOP-16 PACKAGE DESIGNATOR PWP (28) PWP (20) PWP (16) JC(1) (°C/W) 2.07 qJA(1) (°C/W) TA 25°C POWER RATING 2.74 2.67TSSOP-14 PWP 2.07 (1) PowerPAD attached to PCB, 0 lfm airflow, and x 76mm copper area.
MIN Supply Voltage, VDD Operating Free-Air Temperature, 7 -25 NOM MAX 18 +85 UNIT V °C
INPUT STAGE OF BUFFERS to 5 and VCOM to 3 and VCOM to 2 and VCOM VS INPUT STAGE OF BUFFERS to 4 OUTPUT STAGE OF ALL BUFFERSNext Stage Next Stage Buffer Input Buffer Output Buffer Input Buffer Output Next Stage Next Stage
Over operating free-air temperature range, VDD = 25°C, unless otherwise noted. PARAMETER Gamma buffers VIO Input offset voltage VCOM IIB PSRR Input bias current Power-Supply Rejection Ratio Buffer gain SR 3dB bandwidth Slew rate Gamma buffers VCOM buffer Gamma buffers VCOM buffer = VDD/2 VDD = 100 pF, = 100 pF, 2 k VIN 16 V VIP-P = 1 kHz = 9V TEST CONDITIONS TA 25°C Full range(1) 25°C Full range(1) 25°C Full range(1) 25°C Full 25°C dB V/V MHz V/µs pA -1 MIN TYP -1 MAX mV UNIT
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