|Category||Semiconductors => Power Management => LCD/OLED Display Bias Solutions|
|Part family||BUF11702 10+1 Channel High Current Buffer|
|Description||10+1 Channel High Current Buffer 28-HTSSOP 0 to 70|
|Company||Texas Instruments, Inc.|
|Datasheet||Download BUF11702PWP datasheet
|Pin nb||Package type||Ind std||JEDEC code||Package qty||Carrier||Device mark||Width (mm)||Length (mm)||Thick (mm)||Pitch (mm)|
|• Driving Capacitive Loads with Gamma Buffers | Doc|
FEATURES D Gamma Correction Channels: 6 D Integrated VCOM Buffer D Excellent Output Current Drive:
The BUFxx702 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, various channel options are offered. For additional space and cost savings, a VCOM channel with higher current drive capability is integrated in the BUF11702 and BUF07702. The various buffers within the BUFxx702 are carefully matched to the voltage I/O requirements for the gamma correction application. Each buffer is capable of driving heavy capacitive loads and offers fast load current switching. The VCOM channel has increased output drive > 100mA and can handle even larger capacitive loads. The BUF07702, as well as the BUF11702, are available in the TSSOP-PowerPAD package for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package. A flow-through pin out has been adopted to allow simple PCB routing and maintain the cost effectiveness of this solution. All inputs and outputs of the BUFxx702 incorporate internal ESD protection circuits that prevent functional failures at voltages to 4kV (HBM) as tested under MIL-STD-883C Method 3015.
D Large Capacitive Load Drive Capability D Rail-to-Rail Output D PowerPAD Package D Low-Power/Channel: 340µA D Wide Supply Range: 16V D Specified for 85°C D High ESD Rating: 4kV
formation is provided for reference only. For new designs, the pin-compatible BUF07703 is recommended and can be found at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
over operating free-air temperature range unless otherwise noted(1) PARAMETERS Supply, VDD(2) Input Voltage Range, VI Continuous Total Power Dissipation Operating Free-Air Temperature Range, TA Maximum Junction Temperature, TJ Storage Temperature Range, TSTG BUFXX702 16.5 VDD See Dissipation Rating Table to 150 UNIT V
Lead Temperature 1.6mm (1/16 inch) from Case for °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND.
PRODUCT BUF11702 BUF07702(2) PACKAGELEAD TSSOP28 TSSOP20 PACKAGE DESIGNATOR(1) PWP SPECIFIED TEMPERATURE RANGE to +85°C ORDERING NUMBER BUF07702PWP BUF07702PWPR TRANSPORT MEDIA, QUANTITY Tube, 50 Reels, 2000 Tube, 70 Reels, 2000
(1) For the most current specification and package information, refer to our web site at www.ti.com. (2) The BUF07702 is not recommended for design. For new designs, the pincompatible BUF07703 is recommended.
PACKAGE TYPE TSSOP28 TSSOP20(3) PACKAGE DESIGNATOR PWP (28) JC (°C/W) 0.72 JA(1) (°C/W) TA 25°C(2) POWER RATING 3.8 W
PWP With 2oz trace and PowerPAD soldered to copper landing pad. 125°C. (3) The BUF07702 is not recommended for design. For new designs, the pincompatible BUF07703 is recommended.MIN Supply Voltage, VDD Operating Free-Air Temperature, 4.5 0 NOM MAX 16 85 UNIT V °C
to 5 and VCOM to 3 and VCOM VS Next Stage Buffer Input Buffer Output Internal to BUF11702 GND Internal BUF11702 VS Buffer Input Buffer Output Next StageVS Previous Stage Inverting Input Previous Stage GND Buffer Output
Over operating free-air temperature range, VDD = 25°C, unless otherwise noted. PARAMETER VIO Input offset voltage TEST CONDITIONS TA 25°C Full Range(1) 25°C IIB Input bias current = VDD/2 Full Range(1) 25°C kSVR Supply voltage rejection ratio (VDD/VIO) Buffer gain SR 3dB bandwidth Slew rate Gamma buffers VCOM buffer Gamma buffers VCOM buffer VDD = 100 pF, = 100 pF, 2 k VIN to ±5 mA, 0.1 µs See Figure 0.1% VI kHz VIPP = 1 kHz Full Range(1) 25°C Full Range(1) Full 25°C dB V/V MHz V/µs mV µs nV/Hz dB pA MIN TYP 1.5 MAX 15 mV UNIT
Transient load regulation Transient load response tS (Isink) tS (Isrc) Settling time-current Settling time-current Gamma buffers VCOM buffer Gamma buffers VCOM buffer
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