|Category||Optoelectronics => Drivers/Controllers => LCDs|
|Description||6 Channel LCD Gamma Correction Buffer + Vcom|
|Company||Texas Instruments, Inc.|
|Datasheet||Download BUF07703 datasheet
FEATURES D Gamma Correction Channels: 4 D Integrated VCOM Buffer D Excellent Output Current Drive:
Gamma Channels: 10mA VCOM: > 100mA typ Large Capacitive Load Drive Capability Rail-to-Rail Output PowerPAD Package: BUF07703 Low-Power/Channel: < 250µA Wide Supply Range: to 16V Specified for to 85°C High ESD Rating: 4kV HBM, 1.5kV CDMDESCRIPTION
The BUFxx703 are a series of multi-channel buffers targeted towards gamma correction in high-resolution liquid crystal display (LCD) panels. The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, various channel options are offered. For additional space and cost savings, a VCOM channel with higher current drive capability is integrated in the BUF07703 and BUF05703. A flow through pin out has been adopted to allow simple PCB routing and maintain the cost effectiveness of this solution. All inputs and outputs of the BUFxx703 incorporate internal ESD protection circuits that prevent functional failures at voltages to 4kV HBM and 1.5kV CDM. The various buffers within the BUFxx703 are carefully matched to the voltage I/O requirements for the gamma correction application. Each buffer is capable of driving heavy capacitive loads and offers fast load current switching. The VCOM channel has increased output drive > 100mA and can handle even larger capacitive loads. The BUF07703 is available in the HTSSOP PowerPAD package for dramatically increased power dissipation capability. The BUF06703 and BUF05703 are available in standard TSSOP-16 and TSSOP-14 packages.APPLICATIONS D LCD Flat Panel Displays D LCD Television Displays
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
over operating free-air temperature range unless otherwise noted(1) PARAMETERS Supply, VDD(2) Input Voltage Range, VI Continuous Total Power Dissipation Operating FreeAir Temperature Range, TA Maximum Junction Temperature, TJ Storage Temperature Range, TSTG BUFXX703 16.5 UNIT V
Lead Temperature 1.6mm (1/16 inch) from Case for °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND.
PRODUCT PACKAGELEAD PACKAGE DESIGNATOR(1) PWP PW SPECIFIED TEMPERATURE RANGE +85 85°C ORDERING NUMBER BUF05703PW BUF05703PWR TRANSPORT MEDIA, QUANTITY Tube, 70 Reels, 2000 Tube, 90 Reels, 2000 Tube. 90 Reels, 2000
(1) For the most current specification and package information, refer to our web site at www.ti.com.
PACKAGE TYPE TSSOP20 PowerPAD TSSOP16 TSSOP14 PACKAGE DESIGNATOR PWP JC ( C/W) JA ( C/W) TA 25°C POWER RATING 1.15W 1.11W(1) Thermal specifications assume 2oz trace and copper pad with solder.
MIN Supply Voltage, VDD Operating Free-Air Temperature, TA TSSOP-20 PowerPAD Junction Temperature 4.5 0 NOM MAX UNI V °C
to 3 and VCOM to 2 and VCOM VS Next Stage Buffer Input Buffer Output GND VS Buffer Input Buffer Output Next StageVS Previous Stage Inverting Input Previous Stage GND Buffer Output
over operating free-air temperature range, VDD = 25°C, unless otherwise noted. PARAMETER VIO Input offset voltage TEST CONDITIONS TA 25°C Full Range(1) 25°C IIB Input bias current = VDD/2 Full Range(1) 25°C kSVR Supply voltage rejection ratio (VDD/VIO) Buffer gain SR 3dB Bandwidth Slew Rate Gamma Buffers VCOM Buffer Gamma Buffers VCOM Buffer VDD = 2k VIN = 0.1µs See Figure = 1kHz VIPP = 1kHz Full Range(1) 25°C Full Range(1) Full 25°C dB V/V MHz V/µs mV µs nv/Hz dB pA MIN TYP 1.5 MAX 15 mV UNIT
Transient Load Regulation Transient Load Response tS (Isink) tS (Isrc) Settling TimeCurrent Settling TimeCurrent Gamma Buffers VCOM Buffer Gamma Buffers VCOM Buffer
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