Details, datasheet, quote on part number: 1N581830
DescriptionLow Drop Power Schottky Rectifier
CompanyST Microelectronics, Inc.
DatasheetDownload 1N581830 datasheet


Features, Applications

MAIN PRODUCTS CHARACTERISTICS IF(AV) VRRM Tj VF (max) FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW FORWARD VOLTAGE DROP DO41 DESCRIPTION Axial Power Schottky rectifier suited for Switch Mode Power Supplies and high frequency to DC converters. Packaged in DO41 these devices are intended for use in low voltage, high frequency inverters, free wheeling, polarity protection and small battery chargers. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj dV/dt * : Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage 10 ms Sinusoidal Value 1N5819 to Unit °C V/µs 0.45 V

dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j-a) dTj

THERMAL RESISTANCES Symbol Rth (j-a) Rth (j-l) Junction to ambient Junction to lead Parameter Lead length 10 mm Lead length 10 mm Value 100 45 Unit °C/W

STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Forward voltage drop Tests Conditions = 25°C Pulse test = 380 µs, 2% To evaluate the conduction losses use the following equations 0.3 x IF(AV) IF2(RMS ) for 0.3 x IF(AV) IF2(RMS ) for VR = VRRM 1N5818 1N5819 Unit mA V

Fig. 1: Average forward power dissipation versus average forward current (1N5817/1N5818).
Fig. 2: Average forward power dissipation versus average forward current (1N5819).
Fig. 2-1: Average forward current versus ambient temperature (=0.5) (1N5817/1N5818).
Fig. 2-2: Average forward current versus ambient temperature (=0.5) (1N5819).

Fig. 3-1: Non repetitive surge peak forward current versus overload duration (maximum values) (1N5817/1N5818).

Fig. 3-2: Non repetitive surge peak forward current versus overload duration (maximum values) (1N5819).

Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(Cu)=35mm, recommended pad layout).

Fig. 5: Junction capacitance versus reverse voltage applied (typical values).


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