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Details, datasheet, quote on part number:HMPS-2822
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Datasheet text preview:
Agilent HMPS-282x Series MiniPak Surface Mount RF Schottky Barrier Diodes
Data Sheet
Features · Surface mount MiniPak package low height, 0.7 mm (0.028") max. small footprint, 1.75 mm2 (0.0028 inch2) · Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging. This series of Schottky diodes is the most consistent and best all-round device available, and finds applications in mixing, detecting, switching, sampling, clamping and wave shaping at frequencies up to 6 GHz. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance. Package Lead Code Identification (Top View)
2
Single 3 4 3 Anti-parallel 4 3 Parallel 4
The HMPS-282x family of diodes offers the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics. Note that Agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.
· Single and dual versions · Matched diodes for consistent performance · Low turn-on voltage (as low as 0.34 V at 1 mA) · Low FIT (Failure in Time) rate* · Six-sigma quality level
* For more information, see the Surface Mount Schottky Reliability Data Sheet.
Pin Connections and Package Marking
3 4
AA
1 Product code Date code
2 #0
1
2 #2
1
2 #5
1
Notes: 1. Package marking provides orientation and identification. 2. See "Electrical Specifications" for appropriate package marking.
HMPS-282x Series Absolute Maximum Ratings [1], TC = 25°C Symbol
If PIV Tj Tstg jc
Parameter
Forward Current (1 µs pulse) Peak Inverse Voltage Junction Temperature Storage Temperature Thermal Resistance [2]
Units
A V °C °C °C/W
MiniPak 1412
1 15 150 -65 to +150 150
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications, TC = +25°C, Single Diode [4]
Minimum Breakdown Voltage VBR (V) 15 Maximum Forward Voltage VF (mV) 340 Maximum Forward Voltage VF (V) @ IF (mA) 0.5 10 Maximum Reverse Leakage IR (nA) @ VR (V) 100 1 Typical Dynamic Resistance RD () [4] 12
Part Number HMPS2820 2822 2825
Package Marking Code L K J
Lead Code 0 2 5
Configuration Single Anti-parallel Parallel
Maximum Capacitance CT (pF) 1.0
Test Conditions
IR = 100 µA
IF = 1 mA [1]
VF = 0 V f = 1 MHz[2]
IF = 5 mA
Notes: 1. VF for diodes in pairs is 15 mV maximum at 1 mA. 2. CTO for diodes in pairs is 0.2 pF maximum. 3. Effective carrier lifetime () for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA. 4. RD = RS + 5.2 at 25°C and If = 5 mA.
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Linear Equivalent Circuit Model Diode Chip
Rj RS
SPICE Parameters Parameter
BV CJ0 EG IBV
Units
V pF eV A A V
HMPS-282x
15 0.7 0.60 1E-4 2.2E-8 1.08 8.0 0.65 2 0.5
Cj
IS N
RS = series resistance (see Table of SPICE parameters) C j = junction capacitance (see Table of SPICE parameters) 8.33 X 10-5 nT Rj = Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, °K n = ideality factor (see table of SPICE parameters)
RS PB PT M
Linear Circuit Model of the Diode's Package
20 fF 3 30 fF 1.1 nH 2 1 4 30 fF
20 fF Single diode package (HMPx-x8x0) 20 fF 0.05 nH 3 30 fF 0.05 nH 2 12 fF 0.5 nH 0.5 nH 30 fF 0.05 nH 1 0.5 nH 0.5 nH 0.05 nH 4
20 fF Anti-parallel diode package (HMPx-x8x2) 20 fF 0.05 nH 3 30 fF 0.05 nH 2 12 fF 0.5 nH 0.5 nH 30 fF 0.05 nH 1 0.5 nH 0.5 nH 0.05 nH 4
20 fF Parallel diode package (HMPx-x8x5)
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