Details, datasheet, quote on part number: LBWA1UZ1GC-901
PartLBWA1UZ1GC-901
Category
TitleRF TXRX MODULE 802.11A/B/G/N
Description
CompanyAmerica Semiconductor, LLC
DatasheetDownload LBWA1UZ1GC-901 datasheet
  
LBWA1UZ1GC-901 photo

Others parts numbering
IMP005-BREAKOUT: IMP005 DEVELOPMENT KIT

 

Features, Applications

This Datasheet is a preliminary version, and subject to change without notice.

Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.

Issued Date Dec. 25. 2015 Revision Code Revision Page

Changed Items First Issue Adding Structure Adding Pin Layout Revised 6. Operating Condition Adding 9. Digital I/O Requirements Revised 10. RF Characteristics Adding 12. Reference Circuit Modifying Scope and Part Number Changing Block diagram. Updated 4.2. Terminal configurations Adding 5. LED Drive Adding 6. Phototransistor Adding 7. SPI Flash Requirements Updated 12. Pin characteristics Updated 13. Land pattern Updated 14. Reference circuits Updated 15. Recommended component Erased RF Characteristics

Preliminary Specification Number Scope.....................................................................................................................................................3 2. Part Number........................................................................................................................................3 3. Block Diagram......................................................................................................................................4 4. Dimensions, Marking and Terminal Dimensions....................................................................................................................................5 4.2. Terminal Configurations...............................................................................................................7 5. LED Drive.......................................................................................................................................... Phototransistor..................................................................................................................................12 7. SPI Flash Requirements....................................................................................................................13 8. Absolute Maximum Rating................................................................................................................14 9. Operating Condition..........................................................................................................................14 10. External 32.768 kHz Low-Power Oscillator...................................................................................14 11. Power Sequence..........................................................................................................................15 12. Digital I/O Specifications.................................................................................................................16 13. Land pattern (Top View)..................................................................................................................17 14. Reference Circuits............................................................................................................................18 14.1. Module connections...................................................................................................................18 14.2. Blinkup circuit...........................................................................................................................19 14.3. Boot flash & status Antenna......................................................................................................................................19 14.5. Ethernet 10/100Mbps................................................................................................................20 15. Recommended Components.............................................................................................................21 15.1. Bi-color Phototransistor..........................................................................................................................21 15.3. SPI Flash...................................................................................................................................21 15.4. Blinkup circuit...........................................................................................................................21 15.5. Ethernet PHY magnetics......................................................................................................21 16. Tape and Reel NOTICE............................................................................................................................................25 17.1. Storage Conditions:...................................................................................................................25 17.2. Handling Conditions:................................................................................................................25 17.3. Standard PCB Design (Land Pattern and Dimensions):........................................................25 17.4. Notice for Chip Placer:..............................................................................................................25 17.5. Soldering Cleaning:....................................................................................................................................26 17.7. Operational Environment Conditions:.....................................................................................26 17.8. Input Power Capacity:..............................................................................................................26 18. PRECONDITION TO USE OUR PRODUCTS...............................................................................27 Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet.


 

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