|Title||ARM Microcontrollers - MCU BL Microcontrollers|
NXP LPC5411x ARM® Cortex®-M4 Microcontrollers (MCU) are low power consumption MCUs with enhanced debug features and a high level of support block integration. The LPC5411x series include devices with up to 192KB of on-chip SRAM and up to 256KB on-chip flash. The LPC54114 includes an ARM Cortex-M0+ coprocessor. The MCUs address a variety of always-on applications with several interfaces and smart peripherals. These interfaces and peripherals include a Digital Microphone Subsystem, crystal-less FS USB and FlexComm interface.
|Datasheet||Download LPC54114J256BD64QL datasheet
|Others parts numbering|
|OM13089,598: Development Boards & Kits - ARM LPCXpresso54114 board|
32-bit ARM Cortex-M4/M0+ MCU; 192 KB SRAM; 256 KB flash, Crystal-less USB operation, DMIC subsystem, Flexcomm Interface, 32-bit counter/ timers, SCTimer/PWM, 12-bit 5.0 Msamples/sec ADC, Temperature sensor
The LPC5411x are ARM Cortex-M4 based microcontrollers for embedded applications. These devices include an ARM Cortex-M0+ coprocessor, KB of on-chip SRAM, 256 KB on-chip flash, full-speed USB device interface with Crystal-less operation, a DMIC subsystem with PDM microphone interface and I2S, five general-purpose timers, one SCTimer/PWM, one RTC/alarm timer, one 24-bit Multi-Rate Timer (MRT), a Windowed Watchdog Timer (WWDT), eight flexible serial communication peripherals (each of which can be a USART, SPI, or I2C interface), and one 12-bit 5.0 Msamples/sec ADC, and a temperature sensor. The ARM a 32-bit core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point unit is integrated in the core. The ARM Cortex-M0+ coprocessor is an energy-efficient and easy-to-use 32-bit core which is code and tool-compatible with the Cortex-M4 core. The Cortex-M0+ coprocessor offers to 100 MHz performance with a simple instruction set and reduced code size.
Dual processor cores: ARM Cortex-M4 and ARM Cortex-M0+. Both cores operate to a maximum frequency of 100 MHz. ARM Cortex-M4 core (version r0p1): ARM Cortex-M4 processor, running at a frequency to 100 MHz. Floating Point Unit (FPU) and Memory Protection Unit (MPU). ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC). Non-maskable Interrupt (NMI) input with a selection of sources. Serial Wire Debug (SWD) with six instruction breakpoints, two literal comparators, and four watch points. Includes Serial Wire Output for enhanced debug capabilities. System tick timer.
ARM Cortex-M0+ core ARM Cortex-M0+ processor, running at a frequency to 100 MHz (uses the same clock as Cortex-M4) with a single-cycle multiplier and a fast single-cycle I/O port. ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC). Non-maskable Interrupt (NMI) input with a selection of sources. Serial Wire Debug with four breakpoints and two watch points. System tick timer. On-chip memory: 256 KB on-chip flash program memory with flash accelerator and 256 byte page erase and write. 192 KB total SRAM consisting 160 KB contiguous main SRAM and an additional 32 KB SRAM on the I&D buses. ROM API support: Flash In-Application Programming (IAP) and In-System Programming (ISP). ROM-based USB drivers (HID, CDC, MSC, and DFU). Flash updates via USB is supported. Supports booting from valid user code in flash, USART, SPI, and I2C. Legacy, Single, and Dual image boot. Serial interfaces: Flexcomm Interface contains eight serial peripherals. Each can be selected by software be a USART, SPI, or I2C interface. Two Flexcomm Interfaces also include an I2S interface. Each Flexcomm Interface includes a FIFO that supports USART, SPI, and I2S if supported by that Flexcomm Interface. A variety of clocking options are available to each Flexcomm Interface and include a shared fractional baud-rate generator. I2C-bus interfaces support Fast-mode and Fast-mode Plus with data rates to 1Mbit/s and with multiple address recognition and monitor mode. Two sets of true I2C pads also support high speed mode (3.4 Mbit/s) as a slave. Crystal-less USB full-speed device interface. Digital peripherals: DMA controller with 20 channels and 20 programmable triggers, able to access all memories and DMA-capable peripherals. to 48 General-Purpose Input/Output (GPIO) pins. Most GPIOs have configurable pull-up/pull-down resistors, programmable open-drain mode, and input inverter. GPIO registers are located on the AHB for fast access. Up to eight GPIOs can be selected as pin interrupts (PINT), triggered by rising, falling or both input edges. Two GPIO grouped interrupts (GINT) enable an interrupt based on a logical (AND/OR) combination of input states. CRC engine.All information provided in this document is subject to legal disclaimers.
Analog peripherals: 12-bit ADC with 12 input channels and with multiple internal and external trigger inputs and sample rates to 5.0 MSamples/sec. The ADC supports two independent conversion sequences. Integrated temperature sensor connected to the ADC. DMIC subsystem including a dual-channel PDM microphone interface, flexible decimators, 16 entry FIFOs, optional DC locking, hardware voice activity detection, and the option to stream the processed output data to I2S. Timers: Five 32-bit standard general purpose timers/counters, four of which support up to four capture inputs and four compare outputs, PWM mode, and external count input. Specific timer events can be selected to generate DMA requests. The fifth timer does not have external pin connections and may be used for internal timing operations. One SCTimer/PWM with eight input and eight output functions (including capture and match). Inputs and outputs can be routed to or from external pins and internally to or from selected peripherals. Internally, the SCTimer/PWM supports ten captures/matches, ten events, and ten states. 32-bit Real-time clock (RTC) with 1 s resolution running in the always-on power domain. A timer in the RTC can be used for wake-up from all low power modes including deep power-down, with 1 ms resolution. Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation up to four programmable, fixed rates. Windowed Watchdog Timer (WWDT). Clock generation: 12 MHz internal Free Running Oscillator (FRO). This oscillator provides a selectable 48 MHz or 96 MHz output, and a 12 MHz output (divided down from the selected higher frequency) that can be used as a system clock. The FRO is trimmed 1 % accuracy over the entire voltage and temperature range. External clock input for clock frequencies to 25 MHz. Watchdog oscillator (WDTOSC) with a frequency range of 6 kHz to 1.5 MHz. 32.768 kHz low-power RTC oscillator. System PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency external clock. May be run from the internal FRO 12 MHz output, the external clock input CLKIN, or the RTC oscillator. Clock output function with divider. Frequency measurement unit for measuring the frequency of any on-chip or off-chip clock signal. Power control: Programmable PMU (Power Management Unit) to minimize power consumption and to match requirements at different performance levels. Reduced power modes: sleep, deep-sleep, and deep power-down. Wake-up from deep-sleep modes due to activity on the USART, SPI, and I2C peripherals when operating as slaves.
|Some Part number from the same manufacture NXP Semiconductors|
NXP LPC5411x ARM® Cortex®-M4 Microcontrollers (MCU) are low power consumption MCUs with enhanced debug features and a high level of support block integration. The LPC5411x series include devices with
M87C257 : Address Latched 256K (32K X 8) uv EPROM And OTP ROM. INTEGRATED ADDRESS LATCH FAST ACCESS TIME: 45ns LOW POWER "CMOS" CONSUMPTION: Active Current 30mA Standby Current 100µA PROGRAMMING VOLTAGE: 12.75V ELECTRONIC SIGNATURE for AUTOMATED PROGRAMMING TIMES of AROUND 3sec. (PRESTO II ALGORITHM) Figure 1. Logic Diagram The is a high speed 262,144 bit UV erasable and electrically programmable EPROM. The M87C257.
MHW6342 : . . designed specifically for 550 MHz CATV applications. ionimplanted arsenic emitter transistors with 7 GHz fT and an all gold metallization system. Specified for 77Channel Performance Broadband Power Gain @ f MHz 34.5 dB (Typ) @ 50 MHz 35 dB (Min) @ 550 MHz Broadband Noise Figure @ 550 MHz 5.5 dB (Typ) Superior Gain, Return Loss and DC Current Stability.
MR16R082CAN1 : Normal RIMM. = MR16R082CAN1 ;; Density(MB) = 192 ;; Organization = 256Kx16x32s ;; Component Composition = 128M(2nd)x12 ;; Voltage(V) = - ;; Refresh = 16K/32m(1.9us) ;; Speed(MHz)/ TRAC(ns) = 300/53.3,356/45,400/45 ;; #of Pin = 184 ;; Production Status = Eol ;; Comments = Ds,non-ecc.
GTS217E : N-channel Enhancement MODE Power Mosfet. The GTS217E provides the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. *Low on-resistance *Capable of 2.5V gate drive *Optimal DC/DC battery application Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current.
BA32E1 : Hc-49/us Microprocessor Crystals. Package =HC49/US (3.68mm max. ht.) BT=HC49/US (2.50mm max. ht.) BR=HC49/US (2.00mm max. ht.) Tolerance/Stability G=±10/30 H=±20/20 J=± L=±10/25 M=±15/15 Configuration Options I=Insulator Tab, TR=Tape and Reel (ammo for thru-hole), L=Third Lead L3=Third Lead/Base Mount, V=Vinyl Sleeve, AT=Cut of Quartz SP=Spring Mount, G-Gull Wing, G1=Gull Wing/Metal.
AF086X-30 : Continuously Variable Attenuators. RF CONN: INS LOSS: VSWR: RF POWER*: ATTEN RGE: *Higher Power Models Available - Contact Factory SMA female 0.5dB max 1.5 max 5 W avg, 3 Kw peak Many other models to 60dB Our Standard is a Screw Driver Shaft with a Lock Nut The Part Number begins with or AF0 For a Knob Control Option change the AV0 or the AF0 in the P/N or AF9 Example: = AF964-10 For a Turns.
CW3XCT521A103 : coat Insulated, Precision coat Insulated Miniature Wirewound Leaded Resistors.
TLV1544CDG4 : Low-voltage 10-bit Analog-to-digital Converters WITH Serial Control AND 4/8 Analog Inputs.
LM2736X EVAL : Eval Board - Dc/dc & Ac/dc (off-line) Smp Programmers, Development System; BOARD EVALUATION LM2736X. s: Board Type: Fully Populated ; Main Purpose: DC/DC, Step Down ; Regulator Topology: Buck ; Outputs and Type: 1, Non-Isolated ; Voltage - Output: 1.5V ; Current - Output: 750mA ; Voltage - Input: 3 ~ 18 V ; Frequency - Switching: 1.6MHz ; Power - Output:.
FFB26A0435K-- : 4.3µF Film Capacitor Radial; CAP 4.3UF 720V FILM POWER. s: Capacitance: 4.3µF ; Tolerance: ±10% ; Dielectric Material: Polypropylene, Metallized ; Package / Case: Radial ; Packaging: Bulk ; Lead Spacing: 1.083" (27.50mm) ; ESR (Equivalent Series Resistance): - ; Mounting Type: Through Hole ; : General Purpose ; Lead Free Status: Lead Free ; RoHS Status:.
MCF51MM256CLK : Microcontrollers (MCU) 32BIT 256K FLASH. » » » MCUs for Low Power MCUs for Low Power A microcontroller (MCU) is a simplified computer with a processor, memory, and support for peripherals. MCUs are embedded in the electronics systems of machinery, automobiles, telephones, appliances, and in billions of other products using electronics.
QXT2J223KRPT : 0.022µF Film Capacitor Radial; CAP FILM 0.022UF 630VDC RADIAL. s: Capacitance: 0.022µF ; Tolerance: ±10% ; Dielectric Material: Polypropylene, Metallized ; Package / Case: Radial ; Packaging: Bulk ; Lead Spacing: 0.591" (15.00mm) ; ESR (Equivalent Series Resistance): - ; Mounting Type: Through Hole ; : High Frequency and High Stability ; Lead Free Status:.
AT25320AY6-10YH-1.8 : Memory Integrated Circuit (ics) EEPROM Tape & Reel (TR) 1.8 V ~ 5.5 V; IC EEPROM 32KBIT 20MHZ 8DFN. s: Memory Type: EEPROM ; Memory Size: 32K (4K x 8) ; Speed: 5MHz, 10MHz, 20MHz ; Interface: SPI, 3-Wire Serial ; Package / Case: 8-UDFN Exposed Pad ; Packaging: Tape & Reel (TR) ; Voltage - Supply: 1.8 V ~ 5.5 V ; Operating Temperature: -40°C.
RT0805FRE07221RL : 221 Ohm 0.125W, 1/8W Chip Resistor - Surface Mount; RES 221 OHM 1/8W 1% SMD 0805. s: Resistance (Ohms): 221 ; Power (Watts): 0.125W, 1/8W ; Tolerance: ±1% ; Packaging: Tape & Reel (TR) ; Composition: Thin Film ; Temperature Coefficient: ±50ppm/°C ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.
RNF14GTD3R30 : 3.3 Ohm 0.25W, 1/4W Through Hole Resistors; RES 3.3 OHM 1/4W 2% AXIAL. s: Resistance (Ohms): 3.3 ; Power (Watts): 0.25W, 1/4W ; Tolerance: ±2% ; Packaging: Tape & Reel (TR) ; Composition: Metal Film ; Temperature Coefficient: ±100ppm/°C ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.